Optical detection technology is one of the core means of quality control for semiconductor carriers. Due to the fact that the carrier tape is usually made of plastic or metal, with a smooth surface and strong reflectivity, special light source design and imaging schemes are required to accurately capture defects. Common detection methods include bright field illumination, dark field illumination, and multi angle light source combinations to highlight different types of defect features.
In specific applications, line scanning cameras combined with high-frequency light sources can achieve continuous scanning of the surface of the carrier tape, detecting micro scale scratches, pits, or contaminants. Meanwhile, laser displacement sensors can be used to measure the thickness uniformity of the carrier tape, ensuring that it will not cause chip damage due to stress issues during the packaging process. For the detection of hole positions and positioning marks, high-precision edge recognition algorithms are relied upon to ensure that the hole spacing of each carrier is accurately matched with the chip loading position.
Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.
In addition, the application of infrared or ultraviolet light sources can detect stress distribution or microstructural defects inside the carrier material, further improving product quality. With the advancement of detection technology, the combination of multispectral imaging and polarized light technology has also begun to be applied in high-end carrier detection to cope with more complex defect types. In the future, optical inspection will be deeply integrated with automated production lines to achieve more efficient and accurate quality control.