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Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.   YURENGO launches a full range of anti-static packaging products, including black/transparent PS/PC/ABS carrier tapes, snap on/integrated reels, and matching cover tapes. Its transparent PS carrier tape has high transmittance and anti-static properties, making it suitable for packaging optoelectronic components; The reel product supports customization of 4-12 inch specifications and can provide standard packaging of 500 meters per roll or sub packaging according to customer needs.   In depth analysis of the product: Carrier type: Black PS/PC/ABS, Transparent PS/PC Roll design: snap on roll (detachable structure), integrated roll (integral injection molding) Cover tape matching: automatically recommend cover tapes corresponding to 5.4mm-81.5mm based on the width of the carrier tape, with adjustable viscosity

YURENGO recently revealed the technical details of its fully automated production line. The company has 25 flat belt forming machines and 35 roll forming machines, among which the multi roll forming equipment is specially designed for 8-12mm micro sized belts, which can achieve stable output of 500000 meters of belts and 80000 sets of reels per day. Its product bandwidth covers the full size range of 8-120mm and supports customized deep cavity packaging of over a thousand electronic components such as LGA/BGA/TO/SOT.   Our technological advantages: The single roll press is designed to meet the high-precision requirements of 8-16mm bandwidth, while the multi roll press is suitable for large-scale narrowband production. The tolerance control of the flat forming machine reaches ± 0.03mm and supports deep KO position products. The carrier and cover tape sizes are fully matched, providing integrated supply of cover tapes with widths ranging from 5.4mm to 81.5mm.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO, an innovative enterprise in the field of electronic new materials in China, has officially announced its 2025 Cross border Trade Special Plan. As a cross-border subsidiary incubated under Jiangtian Electronic Technology, YURENGO will integrate a three-dimensional strategy of "multi platform operation+independent supply chain+independent station ecosystem", focusing on breaking through international technological barriers in the chip carrier field. The company currently has a monthly production capacity of 18 million meters, covering high-end industries such as consumer electronics, automotive, medical, and military. It supports deep customization according to customer drawings. This cross-border layout aims to promote high-precision anti-static packaging solutions to the European, American, and Southeast Asian markets through a global supply chain network.   Our advantages: Our parent company, Jiangtian Electronic Technology, has a 4500 square meter production base in Jiangsu and a 1500 square meter Ningbo branch. We specialize in micro size tape carriers with 35 roll forming machines and ensure ± 0.03mm ultra-high precision with 28 tablet machines. Our sales revenue will reach 39 million RMB in 2024, and we plan to double our annual growth rate through cross-border business.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO has significant advantages in production and manufacturing capabilities with the strong support of its parent company, Jiangtian Electronic Technology. The company currently has its own factory with a total area of 6000 square meters, including two production bases of 4500 square meters in Jiangyin and 1500 square meters in Ningbo, as well as a 300 square meter research and development laboratory. This scale of production base ensures that the company has the hardware conditions for large-scale production, providing a solid foundation for the goal of producing 500000 meters of tape and 80000 sets of reels per day.   YURENGO is actively promoting its cross-border trade strategy in terms of global market layout. The company plans to sell high-quality chip carrier products to the global market through a three-dimensional model of "multi platform operation plus independent supply chain+independent station ecosystem". The implementation of this strategy will fully leverage the company's comprehensive advantages in product research and development, manufacturing, and supply chain management, helping international customers obtain high-quality, low-cost product solutions.   The company's production management system is also quite distinctive, forming a complete closed-loop management from customer demand confirmation to customized mold production, from sample making to mass production. Especially in the sample confirmation stage, the company will first provide samples for customer confirmation, and only begin large-scale production after obtaining approval to ensure that the product fully meets customer requirements. This rigorous workflow, combined with advanced CCD detection and packaging machines, ensures the stability of product quality. At present, the company's annual sales have reached 39 million yuan, demonstrating strong development momentum.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO has established a comprehensive quality management system and strictly adheres to the ISO9001 quality management system and ISO14001 environmental management system standards. The company adheres to the principle of "zero defects" and the quality concept of "doing things right the first time", and has established seven major quality control projects throughout the entire production process to ensure that every factory product meets the highest quality standards.   In terms of specific quality control, the company adopts advanced testing equipment and strict testing standards. The size measurement is carried out using a 2D non-contact measuring instrument with an accuracy of ± 0.001mm. A sample of 500mm is taken from each roll of the product for testing, and it is fully verified according to the customer's drawing requirements. The tensile strength test uses a dedicated tensile tester with an accuracy of ± 0.001kg, and the standard requirement is not less than 3kg. For the adhesion test of the cover tape, a peeling tester is used to strictly control the adhesion within the range of 30-80g, especially for 8-12mm products, the CPK value is required to be ≥ 1.67.   In terms of reliability testing, the company uses an environmental aging testing system to conduct accelerated aging experiments under harsh conditions of 55 ℃± 2 ℃ and 90% ± 5% RH. The tests are conducted four times a week for a duration of four weeks. In addition, multiple tests such as withstand voltage testing, bending testing, and surface impedance testing are regularly conducted. These strict quality control measures ensure the reliability and stability of the product in various application environments.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO's investment in production equipment reflects a high emphasis on product quality. The company currently has 35 roll forming machines and 28 high-precision flat forming machines, which constitute the core strength of production. Among them, the roll forming machine is particularly suitable for producing micro sized tapes of 8-12mm, with high precision and good stability. The flat forming machine can handle a wider size range of 8-120mm, especially suitable for producing products with larger bandwidth and deeper cavities.   In terms of equipment segmentation, the company's roll forming machines are divided into two types: single track and multi track. The monorail roller machine is specifically designed for producing small-sized products with a bandwidth of 8-16mm and high precision requirements, ensuring consistency and accuracy of micro hole positions. The multi track roller machine is suitable for products with a bandwidth of 8-12mm, and is suitable for the production needs of large quantities of single varieties. Flat panel forming machines are also divided into single track and multi track configurations. Single track flat panel machines are designed to meet customers' high-precision requirements, with an accuracy of ± 0.03mm; multi track flat panel machines can accommodate a bandwidth range of 8-120mm, making them particularly suitable for producing products with wide widths and large cavities.   In addition to tape production equipment, the company is also equipped with 5 fully automatic injection molding machines for reel production, 4 granulators, and 25 flatbed machines and other auxiliary equipment. These devices together form a complete production line, enabling YURENGO to achieve a huge production capacity of 500000 meters of tape and 80000 sets of reels per day. Advanced equipment combined with mature production processes ensures the quality stability of products in various production stages.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO, as a professional semiconductor carrier manufacturing enterprise, is committed to providing comprehensive electronic component packaging solutions to global customers. The company's product line covers various materials such as black PS/PC/ABS carrier tapes, transparent and highly transparent anti-static carrier tapes, which can perfectly meet the full-size packaging requirements of 8mm to 120mm. These products are widely used in various industries such as consumer electronics, medical equipment, communication equipment, automotive electronics, and military industry, accumulating over 1000 electronic component packaging cases, including various packaging forms such as LGA/BGA/TO/SOT/SOD/SOP. In terms of product customization, YURENGO has strong R&D and design capabilities, and can provide in-depth customization services according to customers' personalized needs. The company has a complete product size system, from the smallest 8mm to the largest 88mm carrier tape, all equipped with corresponding specifications of cover tape and reel. Taking 8mm carrier tape as an example, it can be paired with 5.4mm or 5.5mm wide cover tape, with a standard length of 500 meters per roll. Each inner box can hold 35 rolls, and the outer box can accommodate 140 rolls, fully meeting the needs of large-scale production. More importantly, YURENGO not only offers a single carrier tape product, but also provides customers with a complete packaging solution including carrier tapes, cover tapes, and reels. The company attaches great importance to the practicality and adaptability of its products, and all products have undergone strict testing and verification to ensure stability and reliability when operated on automatic mounting equipment. This one-stop service model greatly simplifies the customer's procurement process and improves supply chain efficiency. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Polyester is a rapidly rising carrier material in recent years, occupying an important position in the increasingly stringent environmental requirements of electronic packaging due to its characteristics of "balance of rigidity and toughness+environmentally friendly recyclability". From the perspective of molecular structure, PET is composed of alternating rigid benzene rings and flexible ester groups, endowing it with excellent comprehensive properties: tensile strength up to 70-90MPa, elastic modulus up to 2-3GPa, ensuring that the carrier tape is not easily deformed when carrying heavy load components; At the same time, its elongation at break is about 30% -50%, which is more resilient than PC and can buffer the instantaneous impact force when picking up parts on the surface mounting machine. Environmental friendliness is another highlight of PET - as a thermoplastic polyester, it can be completely decomposed into terephthalic acid and ethylene glycol monomers under specific conditions, with a recycling and re polymerization utilization rate of over 90%, in compliance with EU RoHS, REACH and other environmental directives. In addition, PET has excellent dimensional stability and is not easily expanded or deformed in humid environments, ensuring the accuracy of the carrier hole position. At present, PET carrier tape has been widely used in fields such as automotive electronics and industrial control that require high reliability and environmental protection, especially in scenarios that require high-temperature aging testing (such as 85 ℃/85% RH environment for 1000 hours), it performs well and is an "upgraded substitute" for traditional plastic carrier tape. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Polystyrene is one of the most commonly used basic materials in the field of carrier tapes. With its low cost and stable processing performance, it has become the mainstream choice for carrier tapes in mid to low end electronic components. From a structural perspective, PS is an amorphous polymer with high molecular chain regularity, endowing it with high transparency and smooth surface, which can clearly display the appearance of the component and facilitate its smooth detachment from the carrier. In terms of mechanical properties, the tensile strength of PS is about 35-50MPa, which is slightly lower than PC but sufficient to meet the support requirements of conventional electronic components; Its density is only 1.04-1.06g/cm ³, about 15% lighter than PC, which can reduce the overall weight of the carrier and save transportation costs. More importantly, PS has excellent processing fluidity and fast filling speed during injection molding, making it suitable for rapid production of thin-walled carrier tapes and greatly improving production efficiency. However, PS has weak temperature resistance (thermal deformation temperature of about 70-90 ℃) and is not resistant to high temperature reflow soldering, so it is mostly used in room temperature or low temperature mounting scenarios (such as small discrete components in consumer electronics). But its price is only one-third to one-half of that of PC, with significant advantages in comprehensive cost-effectiveness, and it is still one of the carrier materials with the highest market share. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Polycarbonate is one of the core materials for high-end carrier tapes, and with its unique molecular structure, it has become a major material in the field of electronic component packaging. From a performance perspective, the transmittance of PC can reach over 90%. With its colorless and transparent characteristics, it can clearly display the model and status of electronic components in the carrier hole position, making it easy for manual or machine vision to accurately identify on the production line. In addition, the temperature range of PC is wide (-40 ℃ to 120 ℃), which can withstand high temperature reflow soldering in SMT surface mounting process. The dimensional stability is excellent, ensuring that the carrier tape does not deform and the hole position does not shift in extreme environments. At present, PC carrier tape is widely used in scenarios such as IC chips and precision capacitors that require strict transparency and weather resistance, and is a "must-have" material for high-end electronic packaging. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Faced with global environmental pressures and sustainable development goals, the future trend of the carrier industry is accelerating towards green, low-carbon, and global synergy. Material innovation is the core of green transformation. Although traditional petroleum based plastic carriers have stable performance, they are non degradable and have high production energy consumption. In the future, bio based plastic carriers will gradually be replaced - these materials use corn starch and plant fibers as raw materials, reducing production energy consumption by more than 30%, and can be completely composted and degraded after disposal. In response to the demand for some high-precision components, recyclable composite carrier tapes are also being promoted, solving the waste problem of traditional multi-layer carrier tapes that are "disposable after use". More companies are exploring the use of "plastic free carrier tape" and replacing plastic with waterproof and anti-static paper composite materials. Although it is currently only suitable for low precision scenarios, it provides new ideas for long-term development. Global production layout and digital management are equally crucial. As electronic manufacturing bases shift to emerging markets such as Southeast Asia and India, carrier manufacturers need to establish localized production bases to shorten delivery cycles; Meanwhile, through digital systems, precise control of the entire process from order to delivery can be achieved, enhancing the resilience of the supply chain. The green transformation of carrier tapes is not only the fulfillment of environmental responsibilities, but also injects long-term momentum into the sustainable development of the electronics industry through collaborative innovation in materials, production, and management. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Driven by the continuous thinning and integration of electronic devices, the technological upgrade of carrier tapes is focusing on "smaller, more precise, and more intelligent". Miniaturization is the primary challenge. As the chip manufacturing process enters the era of 3 nanometers, component sizes continue to break records - the 01005 resistor has been reduced to 0.4mm × 0.2mm, and some sensors are even less than 0.1mm ³, which puts extreme demands on the pocket processing accuracy of the carrier tape. In the future, the spacing between carrier pockets may be reduced to below 0.5mm, and the depth tolerance needs to be controlled within ± 0.003mm to ensure precise positioning of small components. At the same time, the processing technology of traditional injection molds is facing bottlenecks, and the introduction of nanoscale CNC engraving technology and laser micro machining will become the key to improving accuracy. Functional integration and intelligence are another major direction. The basic protection functions are no longer sufficient to meet high-end demands. In the future, carrier tapes will integrate more active capabilities: for example, through built-in conductive fibers or metal coatings, carrier tapes can not only shield external static electricity, but also monitor the static voltage of the component storage environment in real time; Intelligent carrier tape with temperature and humidity sensing function, which can provide internal environmental data feedback through RFID tags to ensure that components are in optimal condition throughout transportation; A design with direct communication between the carrier and the SMT machine, which guides the equipment to accurately identify component types and positions through coding markings, improves the efficiency of SMT production lines. These technological breakthroughs will upgrade the carrier from a "passive carrier" to an "intelligent partner" and become the core support for precision electronic manufacturing. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

On the production line of carrier tapes, flatbed machines and rolling machines are the two main devices in the process of generating carrier tapes. A tablet machine is a continuous roll made by pressing flat plastic raw materials into molds with precise positioning holes through high-temperature molding. These positioning holes are prepared for subsequent component embedding, usually arranged in equidistant intervals of 0.5-2mm, with aperture accuracy controlled within ± 0.01mm. The advantage of tablet machines lies in the uniform molding pressure, which ensures the consistency of the thickness of the carrier substrate, especially suitable for producing ordinary carrier tapes with high flatness requirements. The roller machine uses a set of heated pressure rollers to further process the coil output from the tablet machine into component pockets during high-speed operation. The core advantage of a rolling mill is its strong flexibility - by replacing the roller molds with different patterns, the depth, shape, and spacing of the pockets can be quickly adjusted to adapt to different specifications of components such as IC chips and LEDs. At the same time, the rolling mill usually integrates a cooling and shaping module, which can quickly cool down the high-temperature shaped carrier belt within 3 seconds, avoiding deformation. Under the collaboration of the two, a complete carrier can be transported from raw materials to finished products in just a few minutes, with an efficiency of several kilometers per hour. Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

In modern electronic manufacturing, the efficient operation of automated production lines relies on the precise coordination of the carrier tape. Carrier tape is not only the carrier of electronic components, but also a key link connecting the supply chain and production equipment. Through standardized size design, the carrier can seamlessly interface with various automatic feeders, ensuring stable transportation of components in SMT surface mount machines, plug-in machines, and other equipment.   The advantage of carrier tape lies in its standardized and modular characteristics. Each roll of tape usually contains thousands of positioning grooves, and the components are precisely placed by vacuum suction or mechanical clamping, with an error controlled within ± 0.05mm. This high consistency significantly reduces manual intervention and improves production yield. For example, in the field of semiconductor packaging, the carrier tape coupled with a vibrating disc feeder can achieve tens of thousands of component supplies per hour, meeting the needs of large-scale production.   In addition, the trend of intelligentization of carriers is emerging. Some high-end carriers integrate RFID chips for tracking batch, production date and other information, enhancing supply chain management capabilities. Customized carrier tape solutions are becoming increasingly common for special components such as flexible circuit boards or shaped devices, such as multi column carrier tape or shaped groove designs. With the advancement of industry, carrier tapes will not only be limited to physical carrying functions, but will also become an important part of the data chain of smart factories, further optimizing the efficiency and reliability of electronic manufacturing.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

The advancement of carrier materials directly affects the efficiency and reliability of the electronic packaging industry. In the early days, ordinary plastics such as polyethylene were often used as carriers, but due to their poor anti-static performance and insufficient temperature resistance, they were gradually replaced by high-performance materials. The current mainstream carrier materials include polycarbonate , polyethylene terephthalate , and polyimide , which have the characteristics of high strength, high temperature resistance, and low shrinkage, and can adapt to the high-temperature welding environment of SMT production lines.   Among them, PET carrier tape has become the preferred choice for small and medium-sized components due to its moderate cost and good transparency; PI carrier tape, on the other hand, is widely used in high-end fields such as automotive electronics and aerospace due to its excellent high temperature resistance. In addition, the integration of anti-static technology is another major innovation - by adding conductive materials such as carbon nanotubes and metal oxides, the surface resistance of the carrier can be controlled within the range of 10 ⁶~10 ⁹ Ω, effectively preventing electrostatic breakdown of the components.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

Carrier tape is an indispensable basic material in the electronic packaging industry, mainly used to carry and transport various electronic components such as integrated circuits, resistors, capacitors, etc. Its core function is to protect components from static electricity, dust, and physical damage during automated production processes, while ensuring precise positioning and improving production efficiency.   Carrier tapes are usually made of plastic or paper materials, and different holes are designed according to the size and shape of the components. Anti static carrier tape can effectively prevent damage to sensitive components caused by electrostatic discharge, especially in semiconductor packaging.   With the development of electronic products towards miniaturization and high density, carrier technology is also constantly upgrading, such as introducing more precise stamping holes, enhanced anti-static coatings, and sealing solutions that cooperate with cover tapes to ensure the stability of components during transportation and storage. In the future, carrier tapes will develop towards being more environmentally friendly and compatible with advanced packaging technologies, providing reliable support for the electronic manufacturing industry.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.

YURENGO has launched an industry-first comprehensive certification program for its entire range of Cover Tape products. The "Seal of Reliability" program establishes a new benchmark for performance consistency, ensuring that every roll of Cover Tape delivers predictable and flawless performance in high-speed automated assembly environments. The certification involves over 15 separate quality checks, focusing on peel force consistency, seal integrity under varying humidity, and residue-free removal. This program is a critical enhancement to YURENGO's complete packaging system approach. "The Cover Tape is the guardian of the component. A failure here can negate the precision of the world's best SMT Carrier Tape," remarked Mr. Zhang, Quality Assurance Director. The certification applies to all Cover Tape variants, including those paired with standard SMT Carrier Tape, robust High-Temperature Carrier Tape, and protective ESD Carrier Tape. For engineers designing a Custom Carrier Tape, this program provides guaranteed performance data for the recommended Cover Tape, de-risking the integration process and accelerating time-to-market. By certifying the Cover Tape alongside the carrier tape, YURENGO provides a validated, reliable packaging system that minimizes production line stoppages and maximizes manufacturing yield for its clients worldwide.

YURENGO New Materials Co., Ltd., a subsidiary of Jiangtian Electronic Technology, today unveiled a groundbreaking advancement in its High-Temperature Carrier Tape product line. This innovation is set to redefine reliability standards for automotive and industrial electronics packaging. The new tape utilizes a proprietary polymer composite that maintains exceptional dimensional stability and mechanical strength at sustained temperatures exceeding 260°C, effectively preventing warping and pocket deformation during aggressive lead-free soldering processes. This development is integral to the company's broader strategy of enhancing its SMT Carrier Tape portfolio with specialized, high-performance solutions. "As components become more powerful and assembly processes more demanding, the packaging must not only protect but also perform under extreme conditions," stated Dr. Wang, Head of R&D at YURENGO. The new material platform is also available for Custom Carrier Tape projects, allowing clients with unique components to leverage this thermal resilience. Furthermore, to ensure complete system integrity, YURENGO has engineered a dedicated Cover Tape with matching high-temperature resistance, guaranteeing consistent seal strength and clean peel performance post-reflow. For applications requiring dual protection, the formulation can be adapted to create an ESD Carrier Tape variant, offering both superior heat resistance and static dissipation—a critical combination for next-generation power modules and control units.

YURENGO has announced a strategic $5 million investment to expand its dedicated production lines for Custom Carrier Tape and ESD Carrier Tape solutions. This expansion, scheduled for completion in Q4 2024, will increase the company's prototyping capacity by 70% and significantly shorten lead times for complex, client-specific orders. The initiative includes the installation of state-of-the-art CNC machining centers and high-precision molding systems capable of producing tapes for the most intricate and miniature components. The investment underscores the growing demand for tailored packaging that goes beyond standard SMT Carrier Tape offerings. "We are seeing a surge in requests for fully customized solutions that integrate multiple functionalities, such as ESD protection for sensitive communication chips within a Custom Carrier Tape design," explained Ms. Chen, Director of Custom Solutions. A key part of this expansion is the integration of a new Cover Tape development lab. This lab will focus on formulating and testing custom Cover Tape seals that are perfectly matched to the unique dimensions and material properties of each Custom Carrier Tape and ESD Carrier Tape project. Additionally, the new lines will be equipped to handle specialized materials, including those for High-Temperature Carrier Tape, ensuring that custom solutions can meet the rigorous demands of any application environment, from consumer electronics to aerospace.

The materials of semiconductor carriers are diverse, including PET, PI, metal foil, etc. The physical properties of different materials impose differentiated requirements on the process parameters of flatbed machines. For example, PET carrier tape has high ductility and needs to be flattened through moderate heating and pressure; And metal carriers require more precise tension control to avoid stress cracking during processing.   The design of tablet machines needs to consider the temperature resistance, tensile strength, and surface roughness of materials. For example, for carriers that are prone to thermal deformation, tablet machines need to use low-temperature compression technology and use precision temperature control systems to avoid overheating damage. For high hardness materials, it is necessary to enhance the wear resistance of the rollers and pressure plates to extend the service life of the equipment. In addition, anti-static treatment is also crucial, especially for chip carriers that are sensitive to static electricity. It is necessary to reduce charge accumulation through conductive rollers or ion fans.   Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.   In the future, with the application of new composite materials in the carrier field, flatbed machines will develop towards more flexible process adaptation, quickly switching between different material processing modes through modular design to meet diverse production needs.