The materials of semiconductor carriers are diverse, including PET, PI, metal foil, etc. The physical properties of different materials impose differentiated requirements on the process parameters of flatbed machines. For example, PET carrier tape has high ductility and needs to be flattened through moderate heating and pressure; And metal carriers require more precise tension control to avoid stress cracking during processing.
The design of tablet machines needs to consider the temperature resistance, tensile strength, and surface roughness of materials. For example, for carriers that are prone to thermal deformation, tablet machines need to use low-temperature compression technology and use precision temperature control systems to avoid overheating damage. For high hardness materials, it is necessary to enhance the wear resistance of the rollers and pressure plates to extend the service life of the equipment. In addition, anti-static treatment is also crucial, especially for chip carriers that are sensitive to static electricity. It is necessary to reduce charge accumulation through conductive rollers or ion fans.
Our carrier tapes include PS carrier tape, PC carrier tape, and BGA transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod drawings and contact us.
In the future, with the application of new composite materials in the carrier field, flatbed machines will develop towards more flexible process adaptation, quickly switching between different material processing modes through modular design to meet diverse production needs.