YURENGO New Materials Co., Ltd., a subsidiary of Jiangtian Electronic Technology, today unveiled a groundbreaking advancement in its High-Temperature Carrier Tape product line. This innovation is set to redefine reliability standards for automotive and industrial electronics packaging. The new tape utilizes a proprietary polymer composite that maintains exceptional dimensional stability and mechanical strength at sustained temperatures exceeding 260°C, effectively preventing warping and pocket deformation during aggressive lead-free soldering processes.
This development is integral to the company's broader strategy of enhancing its SMT Carrier Tape portfolio with specialized, high-performance solutions. "As components become more powerful and assembly processes more demanding, the packaging must not only protect but also perform under extreme conditions," stated Dr. Wang, Head of R&D at YURENGO. The new material platform is also available for Custom Carrier Tape projects, allowing clients with unique components to leverage this thermal resilience. Furthermore, to ensure complete system integrity, YURENGO has engineered a dedicated Cover Tape with matching high-temperature resistance, guaranteeing consistent seal strength and clean peel performance post-reflow. For applications requiring dual protection, the formulation can be adapted to create an ESD Carrier Tape variant, offering both superior heat resistance and static dissipation—a critical combination for next-generation power modules and control units.
